Connector



Description：
CA2, a special copper alloy with good strength, high conductivity and heat dissipation

Applications：
Radiator fin, heat dissipation board, mobile phone medium plate, ... etc.

Chemical Contents

Cu Others
Bal. 0.05 Max
(Wt%)
Physical Property
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)		 Electric Conductivity (%IACS)　
V1 350~450 120 90~130 >3 96
V2 450~500 120 110~180 >3 96

Description：
CA3, a special copper alloy with high strength, high conductivity and high heat dissipation.

Applications：
Shielding case, antenna, heat dissipation, mid plate of mobile phone ...etc.

Chemical Content

Cu Others
Bal. 0.16 Max
(Wt%)
Physical Property
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)		 Electric Conductivity　(%IACS)
V1 500~580 360~400 100~150 >4 80
V2 550~630 - 120~200 >3 80

Description

DSC-3N, a special alloy with effective combination of
High thermal conductivity (above 350W/m·K)
Softening resistance (200K higher than C10200)
High tensile strength (30% higher than C10200).
High electric conductivity 92%IACS.
Compare to C1020, heat resistance increased by 100℃, strength increased by 30%. 
Excellent thermal conductivity while using lead-free solder in assembly process


Applications
Main applications: heat sink bases, head spreaders, high current terminals, bus bars, lead frames
thermal devices, bus bars, IC lead frame, and high power applications.

Chemical Contents

Cu Fe + Ni + Sn + Zn + P
99.9 0.1
(Wt%)

Physical Properties

Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)

O

250-320

140

≥90

≥30

1/4H

280-350

280

90-120

≥15

1/2H

320-390

340

100-130

≥8

H

370-440

410

110-140

≥5

EH

≥400

450

≥120

≥3
Description
C17200 beryllium copper alloy, also known as Alloy 25
It has notable high strength and hardness, and
almost same as of steel. 

Chemical Contents
Be Cu
< 2.0 Bal.
(Wt%)

Physical Property
Before Heat Treatment
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)		 Electric Conductivity
(%IACS)
O 410~540 - 90~160 >35 -
1/4H 510~620 - 145~220 >10 -
1/2H 590~695 - 180~240 >5 -
H 685~835 - 210~270 >2 -
 
Post Heat Treatment
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)		 Electric Conductivity 
(%IACS)　
O 1100~1380 >960 350~400 >3 >22
1/4HT 1180~1400 >1030 360~430 >2 >22
1/2HT 1240~1440 >1100 370~440 >2 >22
HT 1270~1480 >1140 380~450 >1 >22

Description
C17500 is a beryllium copper alloy with both high electric and thermal conductivity plus good strength,
machinability, fatigue and corrosion resistance. Good to do harderning inhouse.

Applications
Connector, relay, motor, EMI shielding or spring collars

Chemical Contents

Be Cu
< 2.0 Bal.
(Wt%)

Physical Property
Before Heat Treatment
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)		 Electric Conductivity
(%IACS)
O 410~540 - 90~160 >35 -
1/4H 510~620 - 145~220 >10 -
1/2H 590~695 - 180~240 >5 -
H 685~835 - 210~270 >2 -
 
Post Heat Treatment
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)		 Electric Conductivity 
(%IACS)　
O 1100~1380 >960 350~400 >3 >22
1/4HT 1180~1400 >1030 360~430 >2 >22
1/2HT 1240~1440 >1100 370~440 >2 >22
HT 1270~1480 >1140 380~450 >1 >22
Description
C19025, also known as NB-109
Excellent stress relaxation property
Greater tensile strength and spring properties than NB-105 alloy
Excellent bend formability, good for size reduction
High reliability and low cost for electric and electronic components

Applications
Connectors, switches, relays or IC lead frames, widely used in automobile industry.

Chemical Contents                                          
Cu Ni Sn P
Bal. 1.00% 0.90% 0.05%

Description
C1990 Titanium Copper Alloy,YCuT, has both strength and conductivity
and also good machinerability, fatigue and corrosion resistance.

Applications
Charging connector and mobile phone terminals.

Chemical Contents

Cu

Ti

Bal.

2.9~3.6

(WT%)

Physical Property

Quality Grade

Tensile Strength
(N/mm2)

Yield Strength
(N/mm2)

Hardness
(HV)

Density
(g/cm3)

H

885~1080

580~750

290~340

8.7

EH

980~1180

1020

310~360

SH

1030~1290

1160

320~380

8.7

Description
C44250, also known as AD-442
An upgraded brass to compensate the lack of hardness, poor strength and cost.
Conductivity 25%IACS, about twice of phosphorus bronze. 
Stress corrosion cracking resistance is 3-10 times than brass.
Good substitution for high strength phosphorous bronze.


Applications
New generation terminals, small connectors, switches, relays

Chemical Contents
Cu Zn Sn
74.20% 25.00% 0.80%
Description
C7025, Copper Nickel Silicon Alloy
high hardness, strength and heat resistance
A good and lower cost replacement of low-Beryllium Copper

Applications
Connectors, heat dissipation and any parts require higher hardness

Chemical Content
Ni Si Mn Cu
3.0 0.65 0.15 Bal.
(Wt%)
 
Physical Property
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		 Elongation
(%)		 Electric Conductivity　(%IACS)
TM02 655~827 596~760 >190 >7 46
TM03 690~860 655~830 >200 >5 46
 
Description
C7035 Copper Nickel Silicon Alloy
High hardness, strength and heat resistance.
A good and lower cost replacement of low-Beryllium Copper.

Applications
Connectors, heat dissipation and any parts require higher hardness.

Chemical Content
Ni Co Si Cu
1.5 1.1 0.6 Bal.
(Wt%)
 
Physical Property
Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		   Elongation
(%)		 Electric Conductivity
(%IACS)
TM04 770~900 750~850 220~280 >4 50
TM06 840~970 810~920 240~300 >1 50
XE 920~1080 880~1040 >260 >1 40
XS 980~1140 940~1100 >280 >1 40

C2680 Soft-Temper Brass Foil

 
Production information

Description
Brass Foil - Soft Tempter
Alloy: C2680-O
Thickness: 0.1mm
Soft-temper Brass Strip is excellent for stamping process required of outstanding elongation
Also good for making deep drawing products


Applications

RF Connectors, Heat Sink, Parts of Cellphone Camera Module


Chemical Contents

 

Cu Fe Pb Zn
64.0～68.0 0.05＜ 0.05＜ Bal.

Physical Properties

Quality Grade Tensile Strength
(N/mm2)		 Yield Strength
(N/mm2)		 Hardness
(HV)		   Elongation
(%)
O >275 - <90 >40
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